Electronics

Assembly cleaning, ionic residue control and ESD protection in electronics manufacturing.

Datasheet per part number

Standards referenced

Recurring consumption

An electronic assembly fails because of things you cannot see: ionic residue left under a component, a fibre bridging two traces, a discharge that degrades a junction without destroying it. Cleaning and static control are not the end of the line; they are part of the process.

Products for this industry

VANTERIS 3-Ply Pleated Face Mask, BlueVNT-73P-BL-5017.5 × 9.5 cm

VANTERIS Polyester Wipe 9 × 9 inVTN-WP-PES-LS-999 × 9 in (228.6 × 228.6 mm)

VANTERIS Sticky Mat 24 × 36 in, BlueVTN-MAT-PE-STK-2436-BLU24 × 36 in

VANTERIS Antislip Shoe Cover, BlueVTN-AP-PP-SC-UNI-BLU

Typical challenges

Ionic residue and electrochemical migration
Loose fibre between conductors
Latent electrostatic discharge damage
Wiper compatibility with isopropyl alcohol

Reference standards

IPC J-STD-001	Requirements for soldered electrical and electronic assemblies.
IPC-A-610	Acceptability criteria for electronic assemblies.
IPC-TM-650	Test methods, including cleanliness and ionic residue.
ANSI/ESD S20.20	Requirements for an electrostatic discharge control programme.